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NTMS4107N
Power MOSFET
30 V, 18 A, Single N?Channel, SO?8
Features
?
?
?
?
Ultra Low R DS(on) (at 4.5 V GS ), Low Gate Resistance and Low Q G
Optimized for Low Side Synchronous Applications
High Speed Switching Capability
Pb?Free Package is Available
V (BR)DSS
http://onsemi.com
R DS(on) TYP
I D MAX
Applications
? Notebook Computer Vcore Applications
? Network Applications
? DC?DC Converters
30 V
3.4 m W @ 10 V
4.7 m W @ 4.5 V
D
18 A
MAXIMUM RATINGS (T J = 25 ° C unless otherwise noted)
Rating
Symbol
Value
Unit
Drain?to?Source Voltage
Gate?to?Source Voltage
V DSS
V GS
30
$ 20
V
V
G
Continuous Drain
Current (Note 1)
Steady
State
T A = 25 ° C
T A = 85 ° C
I D
15
11
A
S
t v 10 s
T A = 25 ° C
18
MARKING DIAGRAM/
Power Dissipation
(Note 1)
Continuous Drain
Current (Note 2)
Power Dissipation
(Note 2)
Steady
State
t v 10 s
Steady
State
T A = 25 ° C
T A = 25 ° C
T A = 85 ° C
T A = 25 ° C
P D
I D
P D
1.67
2.5
11
8.0
0.93
W
A
W
8
1
SO?8
CASE 751
STYLE 12
PIN ASSIGNMENT
1 8
Source Drain
Source Drain
Source Drain
Gate Drain
(Top View)
Pulsed Drain Current
t p = 10 m s
I DM
56
A
Operating Junction and Storage Temperature
Continuous Source Current (Body Diode)
Single Pulse Drain?to?Source Avalanche
Energy (V DD = 30 V, V GS = 10 V, I PK = 32 A,
L = 1 mH, R G = 25 W )
Lead Temperature for Soldering Purposes
(1/8 ″ from case for 10 s)
T J , T stg
I S
E AS
T L
?55 to 150
3.0
512
260
° C
A
mJ
° C
4107N = Specific Device Code
A = Assembly Location
Y = Year
WW = Work Week
G = Pb?Free Package
(Note: Microdot may be in either location)
THERMAL RESISTANCE RATINGS
ORDERING INFORMATION
Rating
Junction?to?Ambient ? Steady State (Note 1)
Junction?to?Ambient ? t v 10 s (Note 1)
Symbol
R q JA
R q JA
Max
75
50
Unit
° C/W
Device
NTMS4107NR2
NTMS4107NR2G
Package
SO?8
SO?8
Shipping ?
2500/Tape & Reel
2500/Tape & Reel
Junction?to?Ambient ? Steady State (Note 2)
R q JA
135
(Pb?Free)
Maximum ratings are those values beyond which device damage can occur.
Maximum ratings applied to the device are individual stress limit values (not
normal operating conditions) and are not valid simultaneously. If these limits are
exceeded, device functional operation is not implied, damage may occur and
reliability may be affected.
1. Surface?mounted on FR4 board using 1 ″ sq. pad size
(Cu area = 1.127 ″ sq. [1 oz] including traces).
2. Surface?mounted on FR4 board using the minimum recommended pad size
(Cu area = 0.412 ″ sq.).
?For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
? Semiconductor Components Industries, LLC, 2006
February, 2006 ? Rev. 3
1
Publication Order Number:
NTMS4107N/D
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